IC型（自動(dòng)插件）ESL
Pitch:2.54mm
上撥式(可串接) PIN腳內(nèi)彎型
Features
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End stackable for standard 0.1" integrated circuit pitch.
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Molded 0.3" integrated circuit packing outline allowing automatic insertion.
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Smaller size makes better heat convection during PC board reflow wave soldering.
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Top tape sealed to withstand wave soldering, board washing.
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All plastics are UL 94V-0 grade fire retardant.
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Twin contacts designed to ensure stable contact.
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Gold plated contact to ensure low contact resistance and Tin plated terminals to prevent contamination during soldering.
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RoHS Compliant
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