- 詳細(xì)介紹
Features
- End stackable for standard 0.1" integrated circuit pitch.
- Molded 0.3" integrated circuit packing outline allowing automatic insertion.
- Smaller size makes better heat convection during PC board reflow wave soldering.
- Top tape sealed to withstand wave soldering, board washing.
- All plastics are UL 94V-0 grade fire retardant.
- Twin contacts designed to ensure stable contact.
- Gold plated contact to ensure low contact resistance and Tin plated terminal to prevent contamination during soldering.
- RoHS Compliant
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